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[Alfred E. Neuman]

ADVISORY/Cadence and Rambus to Showcase Joint PCI Express Solution at Intel Developer Forum

9/7/2004 9:01:00 AM


Sep 07, 2004 (BUSINESS WIRE)

WHO: Cadence Design Systems, Inc. (CDN) (CDN), the
largest supplier of electronic design technologies and
engineering services, and Rambus Inc. (RMBS), the
leading developer of chip interface products and services.

WHAT: A platform demonstrating the interoperability between the
Cadence(R) PCI Express digital controller IP and the Rambus
RaSer PHY IP. It marks the first phase of interoperability;
a hardware platform is in development for PCI Express
compliance testing during 4Q04.

WHEN: Sept. 7-9, 2004

WHERE: Rambus booth, #104, at the Intel Developer Forum, at the
Moscone South Convention Center in San Francisco.



SOURCE: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.
Doron Aronson, 408-428-4404
doron@cadence.com
or
Rambus Public Relations
Linda Ashmore, 650-947-5411
lashmore@rambus.com



Rambus to Showcase World's First Demonstration of XDR Memory Module Technology
XDIMM Modules and Dynamic Point-to-Point Technology Enable Speed, Flexibility, and Easy Upgrades for Main Memory Applications

9/7/2004 8:01:00 AM


SAN FRANCISCO, Sep 7, 2004 (BUSINESS WIRE) -- Rambus Inc. (RMBS), the leading developer of chip interface products and services, today announced the first-of-its-kind live demonstration of Dynamic Point-to-Point (DPP) technology applied to an XDR(TM) memory system. Rambus's DPP technology is a unique innovation applicable to upgrades for memory modules using point-to-point signaling, allowing users to maximize capacity in their memory systems without compromising performance. This demonstration, being held in Booth 104 at the Intel Developer Forum in San Francisco, displays a high-speed memory controller conducting bi-directional transactions to an XDIMM(TM) module-based system.


"Once memory speeds surpass 1 gigahertz data rates, routing data busses to multiple upgradeable modules becomes a challenge," said Rich Warmke, director of marketing for the Memory Interface Division at Rambus. "To meet the future needs of the PC and home server memory markets, Rambus's DPP technology will be critical for OEMs who want to ship future high-performance memory-enabled PCs or home servers with a single module at full system bandwidth, with the option for a second module upgrade."

A single XDR memory-enabled XDIMM module provides 12.8-25.6 gigabytes per second of peak memory bandwidth using just 32 data signal pairs, and supports between 2 and 18 DRAM devices for a wide range of capacities.

In addition to 3.2GHz to 6.4GHz XDR memory interfaces, Rambus offers DDR and GDDR memory interface solutions for less demanding memory applications. With DDR and GDDR interfaces, Rambus is providing customers with a one-stop shop for all their memory interface needs.

The Dynamic Point-to-Point demonstration using XDIMM modules is being showcased at the Intel Developer Forum, September 7-9, 2004 at Moscone South Convention Center in San Francisco. For more information on DPP as well as other Rambus innovations, visit www.rambus.com.

About Rambus Inc.

Rambus is one of the world's leading providers of advanced chip interface products and services. Since its founding in 1990, the company's innovations, breakthrough technologies and integration expertise have helped industry-leading chip and system companies solve their most challenging and complex I/O problems and bring their products to market. Rambus's interface solutions can be found in numerous computing, consumer, and communications products and applications. Rambus is headquartered in Los Altos, Calif., with regional offices in Chapel Hill, North Carolina, Taiwan and Japan. Additional information is available at www.rambus.com.

SOURCE: Rambus Inc.

Rambus Public Relations
Linda Ashmore, 650-947-5411
lashmore@rambus.com
or
Citigate Cunningham for Rambus
Lisa Kennedy, 415-618-8746
lkennedy@citigagecunningham.com